Qualcomm announces 3D Sonic Sensor 2nd generation. This 3D Sonic Sensor technology is the latest version of the ultrasonic fingerprint sensor under the smartphone screen.
This latest generation sensor has an area of 8mm x 8mm, 77% larger than the surface area of the first generation of 4mm x 9mm.
This second generation 3D Sonic Sensor has a sensor surface size of 8mm x 8mm, a.k.a. 70 percent larger than before. While before the surface area of the sensor is only 4mm x 9mm.
With a larger surface area, users will more easily place their finger on the sensor.
In addition, the accuracy of the user’s fingerprint sensor reading is higher because with a wider area, the fingerprint data collected is also more. Qualcomm claims biometric data collected 1.7x more than ever before.
By combining large sensors and faster processing, Qualcomm promises the 3D Sonic Sensor Gen 2 fingerprint sensor can unlock the phone 50% faster.
The first generation fingerprint sensor Qualcomm launched was the 3D Sonic Sensor, which was launched alongside snapdragon 855 and used by the Samsung Galaxy S10 line. At that time, almost all the fingerprint sensors in the screen used optical sensors called slower and less accurate than ultrasonic sensors.
This latest sensor is actually the third lower-screen fingerprint sensor introduced by Qualcomm. After launching 3D Sonic Sensor in 2018, they introduced 3D Sonic Max in 2019 but never launched commercially.
Qualcomm says the first phones that will use the 3D Sonic Sensor Gen 2 will be released in early 2021. The U.S. company did not disclose a list of vendor partners who will use its latest sensors, but it looks like the technology will be used by the Samsung Galaxy S21 line.
Samsung is one of Qualcomm’s largest partners of fingerprint sensors, having previously used their homemade sensors in the Galaxy S10, Note 10, S20 and Galaxy Note 20.